HZW 0.1mm CPU BGA Reballing Stencil TemplateRepair For iPhone A8 A9 A10

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HZW 0.1mm CPU BGA Reballing Stencil TemplateRepair For iPhone A8 A9 A10



SKU: 41790

Price: US$33.49

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Superhigh Precision HZW 0.1mm BGA Reballing Stencil Template kit for iPhone A8 A9 A10 CPU BGA Repair, New iphone A8 A9 A10 BGA Reballing Stencil Set kit, BGA Reballing Stencil / Positioning Mold / Universal baseplate Base (magnetic).

HZW 0.1mm iPhone A8 A9 A10 CPU BGA Reballing Stencil Template Repair

[Optional BGA Reballing Stencil Package ]: Suggest Choose: BGA Reballing Stencil + Black Positioning Mold (Choose different Package)

Optional 1: A8 CPU upper

Optional 2: A8 CPU lower

Optional 3: A9 CPU upper

Optional 4: A9 CPU lower

Optional 5: A10 CPU lower

Optional Positioning Mold (Black): Not univeral, can't working with different BGA Reballing Stencil Template, need the right model BGA Reballing Stencil, same model Black Positioning Mold just working with the same BGA Reballing Stencil.

0.1mm HZW BGA Reballing Stencil Template for iPhone A8 A9 A10 CPU, it is made by high quality steel, BGA Reballing Stencil + Black Positioning Mold + Universal Repair baseplate, can be heated directely by the hot air gun, it is easy and quickly for reballing iPhone A8 A9 A10 BGA IC, Excellent to replace BGA rework reballing.

Universal Repair baseplate (magnetic).

BGA Reballing Stencil + Positioning Mold

BGA Reballing Stencil Template

0.1mm thickness, high hardness, hardly deformed, increase the success rate on BGA reballing Solder working, it is the top quality BGA Reballing Stencil for iphone A8 A9 A10 BGA IC



HZW 0.1mm CPU BGA Reballing Stencil TemplateRepair For iPhone A8 A9 A10
HZW 0.1mm CPU BGA Reballing Stencil TemplateRepair For iPhone A8 A9 A10
HZW 0.1mm CPU BGA Reballing Stencil TemplateRepair For iPhone A8 A9 A10
HZW 0.1mm CPU BGA Reballing Stencil TemplateRepair For iPhone A8 A9 A10
HZW 0.1mm CPU BGA Reballing Stencil TemplateRepair For iPhone A8 A9 A10
HZW 0.1mm CPU BGA Reballing Stencil TemplateRepair For iPhone A8 A9 A10
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