0.10mm BGA Reballing Stencils for iPhone A10 A9 A8 CPU with Positioning Mold

View larger image

0.10mm BGA Reballing Stencils for iPhone A10 A9 A8 CPU with Positioning Mold



SKU: 41814

Price: US$23.85

In stock

Buy More... Get Lower Prices

Quantity  3+   5+   10+   30+   50+ 
Price  US$4.75    Log In     Log In     Log In     Log In  

Quantity :
Add to wish list

Need Help?
Ask Questions
Share
We accept
Safe buy

iPhone A10 A9 A8 CPU BGA Rework Reballing Stencil Template, 0.10mm BGA Reballing Stencils for iphone A10 A9 A8 BGA Chip. BGA Reballing Stencil + Positioning Mold (Black) + Universal Base Mold (Green)

[ Optional BGA Reballing Stencil Package ]: suggest choose: BGA Reballing Stencil + Positioning Mold (Black), and just 1pcs Universal Base Mold (Green), easy for your working, and also save money

BGA Reballing Stencil + Positioning Mold (Black) + Universal Base Mold (Green) --with magnetic

[ Optional (with magnetic)]:

Optional 1: 0.1mm A8 upper

Optional 2: 0.1mm A8 lower

Optional 3: 0.1mm A9 upper

Optional 4: 0.1mm A9 lower

Optional 5: 0.1mm A10 upper

BGA Reballing Stencil + Positioning Mold (Black) + Universal Base Mold (Green)

Universal Base Mold (Green)

Positioning Mold (Black)

Suggest Choose: BGA Reballing Stencil + Black Positioning Mold (Choose different Package ), and just need 1pcs: Aluminum Mold Base, easy for your working, and also save money



0.10mm BGA Reballing Stencils for iPhone A10 A9 A8 CPU with Positioning Mold
Loading...